Garimella S.V. et al (2008), "Thermal challenges in next-generation electronic systems", IEEE Transaction on Components & Packaging Technologies, vol. 31, No. 4, pp. 801-815.
	Lienhard V.J. (1995), "Liquid jet impingement", Annual Review of Heat Transfer, ed. C. L. Tien, vol. 6, pp. 199-270.
	Incropera F.P. (1999), "Liquid cooling of electronic devices by single phase convection", John Wiley.
	Webb B.W., and Ma C.F. (1995), "Single-phase liquid jet impingement heat transfer", Advances in Heat Transfer, ed. Harnett, Irvine, Cho and Greene, vol. 26, pp. 105-217.
	Wolf D.H., Incropera F.P., and Viskanta R. (1993), "Jet impingement boiling", Advances in Heat Transfer, ed. Hartnett, Irvine, Cho and Greene, vol. 23, pp. 1-132.
	Wadsworth D.C., and Mudawar I. (1992), "Enhancement of single-phase heat transfer and critical heat flux from an ultra-high-flux simulated microelectronic heat source to a rectangular impinging jet of dielectric liquid", Journal of Heat Transfer, vol. 114, pp. 764-768. CrossRef
	Lay J.H., and Dhir V.K. (1995), "Nucleate boiling heat flux enhancement on macro/microstructured surfaces cooled by an impinging jet", Journal of Enhanced Heat Transfer, vol. 2, pp. 177-188. CrossRef
	Copeland D. (1995), "Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement", IEEE Transaction of Components, Packaging & Manufacturing Technology, Part A, vol. 18, No. 3, pp. 510-516.
	Honda H., Takamastu H., and Wei J.J. (2002), "Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness", Journal of Heat Transfer, vol. 124, No. 2, pp. 383-390. CrossRef
	Krishnamurthy S., and Peles Y. (2010), "Flow boiling on micropin fins entrenched inside a microchannel - flow patterns and bubble departure diameter and bubble frequency", Journal of Heat Transfer, vol. 132, Art 041002.
	Bostanci H., Saarloos B.A., Rini D.P., Kizito J.P., and Chow L.C. (2008), "Spray cooling with Ammonia on micro-structured surfaces", Proceedings of the 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2008, pp. 290-295, Orlando, FL.
	Wu S.J., Shin C.H., Kim K.M., Cho H.C. (2007), "Single-phase convection and boiling heat transfer: Confined single and array-circular impinging jets", International Journal of Multiphase Flow, vol. 33, pp. 1271-1283. CrossRef
	Browne E.A., Michna G.J., Jensen M.K., and Peles Y. (2010), "Microjet array single-phase and flow boiling heat transfer with R134a", International Journal of Heat and Mass Transfer, vol. 53, pp. 5027-5034. CrossRef
	Moffat R.J. (1988), "Describing the uncertainties in experimental results", Experimental Thermal and Fluid Science, vol. 1, pp. 3-17. CrossRef
	Dhir V.K. (1998), "Boiling heat transfer", Annual Review of Fluid Mechanics, vol. 30, pp. 365-401. CrossRef
	Nakayama W. (1986), "Thermal management of electronic equipment: A review of technology and research topics", Applied Mechanics Review, vol. 39, pp. 1847-1868. CrossRef
	Poniewski M.E., and Thome J.R. (2008), "Nucleate boiling on micro-structured surfaces", Online publication (E-book) of Heat Transfer Research Institute (HTRI): http://www.htri.net/Public/prodsvcs/NucleateBoiling.pdf